FLUX CORED SOLDER WIRE

The series of resin cored solder wire was first introduced in the market in 1974. Solder House supplies diverse types of solder wires, developed to meet the various requirement for specialized applications. Both RMA and RA type cored wire have excellent wetting action of core flux and an even more important and significant fact is that the flux is totally non-conductive and non-corrosive. The resin cored series of solder wire meets all the National, International and MIL std. QQ-S 571, 'Specs.'

WATER SOLUBLE ORGANIC FLUX CORE SOLDER WIRE

This organic water soluble cored wire is more effective than resin cored solder wire, in soldering difficult metals. The flux is more heat stable thus resulting in minimum smoke and odour. The flux residue can be completely removed with a simple water rinse.

NO-CLEAN SOLDER WIRE

With stricter Fluorocarbon Emission Regulation Act, the non-cleaning process of PCB is essential now. "NO-CLEAN" solder wire is developed by a careful balance of resin and activator to provide minimum residue and excellent reliable joint with low spattering. The most important feature of this solder wire is that after soldering it leaves clear, inert and non corrosive residue, which enhance exceptional wetting on the pads of PCB. It meets MIL-P-28809 cleanliness test and does not require any cleaning.

MULTICORE ADVANTAGE

Microtech Corporation supplies two types of multicore wire, three cored & five cored. If we take a slice of this multicore wire, we can see the separate round cores of flux symmetrically arranged around its perimeter. Only a thin wall of solder separates the flux cores from the surface and the percentage of flux is not higher than the usual cored wire. This type of solder is peripherally arranged because of which it reacts and flows faster. Wetting of this type of solder is faster, complete and uniform, that means you can use less solder and transmit less heat to the joint area.

GENERAL SOLDER WIRE

Solder House supplies all grades of resin cored and solid solder wire for all the general requirements of electronic soldering and is also available in any size, even upto 25 SWG.

HMP-HIGH MELTING POINT SOLDER

A special alloy has been derived for high temperature application e.g. in electric motor, car radiators and high temperature lamps. HMP is also ideal for prevention of reflows of the first connection, where joints are made successively or are very dense.

LOW MELTING POINT ALLOY

Microtech Corporation supplies an alloy that has the lowest melting point. This high performance wire core solder is used because of its low temperature. It is excellent for heat sensitive components, to solder them in the vicinity of previously soldered joints and also for soldering gold plated surfaces.