LOW RESIDUE FLUXES (RNC-4 AND BOND N/C)

RNC-4 and BOND N/C are very low residue organic fluxes formulated for wave soldering of high end electronic assemblies. It is designed for both multilayer, single and double sided copper bare boards. These fluxes contain a small percentage of unique resin and a special solvent system which gives assemblies a very uniform and tack free residue that is fully compatible with resin pre flux coating. Assemblies soldered with this flux have high surface insulation resistance and the residue is even no clean type. As these fluxes have very low solid content, it gives assemblies a cleaner appearance as compared to normal RMA or RA type fluxes. For single sided board it gives good soldering performances at lower pre heating temp. This low residue flux also prevents thermal shock of SMD components. It is being used in the TV, RADIO, VCR, TELEPHONE and COMPUTER industries. NON RESIDUE FLUX (BOND 620-F ANDBOND 620-M) Bond 620-F and Bond 620-M are both non residue halide free fluxes with very low solid content varying from 1.5 - 2.5%. Due to the absence of corrosive halide and careful incorporation of activator-solvent system, theflux is economical. The small residue is non-conductive. Thus, no cleaning is required and it passes all the tests, even the most sensitive COPPER MIRROR test cleaning per QQ-S571 and IPC-TM650. The residue on comb pattern board was tested to possess good surface insulation resistance : a few power of magnitude higher than 10" ohm.cm set by international standards. These fluxes are both effectively and popularly utilized in the consumer tele communication and computer industries. These fluxes are suitable for both bare copper and solder coated circuit boards.

BOND FLUX SELECTION GUIDE